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| 1/11 www.rohm.com 2011.04 - rev. a ? 2011 rohm co., ltd. all rights reserved. led drivers for led backlights backlight led driver for small lcd panels (charge pump type) BD1606MVV description the multi-level brightness control white le d driver not only ensures efficient boost by automatically changing the boost rate but also works as a constant current driver in 64 steps, so that the driving curre nt can be adjusted finely. this ic is best suited to turn on white leds that requ ire high-accuracy led brightness control. features 1) a 6 parallel led driver is mounted 2) 64-step led current adjust function 3) inter-led relative cu rrent accuracy: 3% or less 4) led individual lighting/dimming control via a i 2 c bus interface 5) automatic transition charge pump type dc/dc converter (1,1.5 and 2) 6) high efficiency achieved (90% or more at maximum) 7) various protection functions such as output voltage protection, overcurrent limiter and thermal shutdown circuit are mounte d. 8) small qfn package applications this driver is applicable for various fields such as mobile phones, portable game machines and white goods. absolute ma ximum rating (ta=25 ) parameter symbol limits unit power supply voltage vmax 7 v operating temperature range topr -30 ~ +85 storage temperature range tstg -55 ~ +150 power dissipation pd 780 (*1) mw (*1) when a glass epoxy substrate ( 70mm 70mm 1.6mm) has been mounted, this loss will decrease 6.2mw/ if ta is higher than or equal to 25 . recommended operation range (ta=-30 to +85 ) parameter symbol limits unit operating power supply voltage vcc 2.7~5.5 v no.11040eat24
technical note 2/11 www.rohm.com 2011.04 - rev. a ? 2011 rohm co., ltd. all rights reserved. BD1606MVV technical note 3/11 www.rohm.com 2011.04 - rev. a ? 2011 rohm co., ltd. all rights reserved. BD1606MVV reference data 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 102030405060 state[dec] [%] 0 10 20 30 40 50 60 70 80 90 100 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 vin[v] efficiency [%] 0.0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 01234567 vin[v] led current [ma ] -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0 102030405060 state[dec] inl [lsb] -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0 102030405060 state[dec] dnl [lsb] 0.0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 0.0 0.4 0.8 1.2 1.6 2.0 v led [v] led current [ma ] 0 10 20 30 40 50 60 70 80 90 100 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 vin[v] efficiency [%] 40 50 60 70 80 90 100 234567 vin[v] ( ta= 25oc) efficiency [%] fig.1 circuit current (standby) fig.2 circuit current (operation in 1.0 mode) fig.3 efficiency hysteresis (13ma 6 lights) fig.4 efficiency (3.5ma x 6 lights) fig.10 led current matching fig.11 led current vs. v in (led current 16.5ma) fig.6 efficiency (20ma x 6 lights) fig.5 efficiency (10ma x 6 lights) fig.8 led current characteristics (differential linearity error) fig.9 led current characteristics (integral linearity error) 0.0 0.4 0.8 1.2 1.6 2.0 234567 vin[v] iq [ a] ta =-3 0 ta =25 ta =85 up down ta =25 ta =-3 0 ta =25 ta =85 ta =-3 0 ta =85 ta =-3 0 ta =85 ta =-3 0 ta =-3 0 fig.7 led current characteristics (led current 16.5ma) ta =25 ta =-3 0 ta =25 ta =85 0.0 0.5 1.0 1.5 2.0 2.5 3.0 234 567 vin[v] idd1[ma] 0 10 20 30 40 50 60 70 80 90 100 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 vin[v] efficiency [%] ta =25 ta =85 ta =-3 0 ta =-3 0 ta =85 ta =25 ta =85 ta =25 ta =25 ta =-3 0 ta =85 ta =25 ta =85 technical note 4/11 www.rohm.com 2011.04 - rev. a ? 2011 rohm co., ltd. all rights reserved. BD1606MVV block diagram and recommended circuit example 1, 1.5, 2 charge pump over voltage protect osc tsd i 2 c i/f & control logic vout control charge pump mode control gnd ileda1 ileda2 iledb1 iledb2 en scl sda battery vin vout c1n c1p c2n c2p c1 = 1 f cin = 1 f c out = 1 f iledc2 iledc2 current dac current dac current dac leda1 leda1 ledb1 ledb2 ledc1 ledc2 c2 = 1 f ledacnt ledbcnt ledccnt 6 6 6 fig.12 block diagram and recommended circuit example pin table pin number pin name in/out function pin number pin name in/out function 1 leda1 out led current driver output 9 c2n in/out flying capacitor pin negative (-) side 2 sda in i 2 c bus control pin 10 c2p in/out flying capacitor pin positive (+) side 3 scl in i 2 c bus control pin 11 gnd - gnd 4 en in on/off control 12 ledc2 out led current driver output 5 vout out charge pump output 13 le dc1 out led current driver output 6 vin - power supply 14 ledb2 out led current driver output 7 c1n in/out flying capacitor pin negative (-) side 15 ledb1 out led current driver output 8 c1p in/out flying capacitor pin positive (+) side 16 leda2 out led current driver output technical note 5/11 www.rohm.com 2011.04 - rev. a ? 2011 rohm co., ltd. all rights reserved. BD1606MVV sda en scl i 2 c interface buffer ven ven sda s cl t su;dat t low s sr p s t buf t hd;sta t su;sta t high t hd;sta t f t hd ; dat t su;sto t r description of operations (1) led driver ?i 2 c bus interface BD1606MVV can control the led on/off, brightness and char ge pump switching frequency change by writing to the register via the i 2 c bus interface. control by the i 2 c bus interface is effective when en is at ?h? kevel. when en is at ?l? level, this lsi is completely shut down an d control and associated functions via the i 2 c bus interface are all stopped. as shown in fig.13 below, the i 2 c bus interface of BD1606MVV operates usin g the ven voltage (buffering the en pin voltage) as supply voltage. for this reason , it is desirable that the ?h? voltage in the i 2 c bus interface is equal to the en pin voltage. fig.13 i 2 c bus interface buffer fig.14 i 2 c bus interface timing BD1606MVV operates as a slave device for the i 2 c bus interface. a) slave address a7 a6 a5 a4 a3 a2 a1 r/w 1 1 0 0 1 1 0 1/0 b) data format the data format is shown below. write format: sw as as sr r as as p one-byte register data 7 bit 8 bit 7 bit 8 bit slave address one-byte register address slave address or sw as as as p one-byte register address one-byte register data 7 bit slave address 8 bit 8 bit read format: sw as as sr r as am p one-byte register address slave address one-byte register data slave address 8 bit 7 bit 7 bit 8 bit note) s: start condition w: ?0=write r: ?1=read as: acknowledge (slave -> master) am: no acknowledge sr: repeated start condition p: stop condition technical note 6/11 www.rohm.com 2011.04 - rev. a ? 2011 rohm co., ltd. all rights reserved. BD1606MVV ? register table a) register map address hex register name d7 d6 d5 d4 d3 d2 d1 d0 function 0x00 ledacnt - - ledacnt current setting of ileda1/2 0x01 ledbcnt - - ledbcnt current setting of ileda1/2 0x02 ledccnt - - ledccnt current setting of ileda1/2 0x03 ledpwr cnt - freqnt 1/0 ledc2 ledc1 ledb2 ledb1 leda2 leda1 current driver on/off control note) ?-? : invalid at write time ?-? : ?l? at read time b) description of registers * ledacnt (initial value: undefined) --- technical note 7/11 www.rohm.com 2011.04 - rev. a ? 2011 rohm co., ltd. all rights reserved. BD1606MVV c) led current setting table the following table lists the current setting values in respective register settings. initially, these registers have not been initialized. for this reason, they are not initialized under en= ?0. d5 d4 d3 d2 d1 d0 output current (ma) d5 d4 d3 d2 d1 d0 output current (ma) 0 0 0 0 0 0 0.5 1 0 0 0 0 0 16.5 0 0 0 0 0 1 1.0 1 0 0 0 0 1 17.0 0 0 0 0 1 0 1.5 1 0 0 0 1 0 17.5 0 0 0 0 1 1 2.0 1 0 0 0 1 1 18.0 0 0 0 1 0 0 2.5 1 0 0 1 0 0 18.5 0 0 0 1 0 1 3.0 1 0 0 1 0 1 19.0 0 0 0 1 1 0 3.5 1 0 0 1 1 0 19.5 0 0 0 1 1 1 4.0 1 0 0 1 1 1 20.0 0 0 1 0 0 0 4.5 1 0 1 0 0 0 20.5 0 0 1 0 0 1 5.0 1 0 1 0 0 1 21.0 0 0 1 0 1 0 5.5 1 0 1 0 1 0 21.5 0 0 1 0 1 1 6.0 1 0 1 0 1 1 22.0 0 0 1 1 0 0 6.5 1 0 1 1 0 0 22.5 0 0 1 1 0 1 7.0 1 0 1 1 0 1 23.0 0 0 1 1 1 0 7.5 1 0 1 1 1 0 23.5 0 0 1 1 1 1 8.0 1 0 1 1 1 1 24.0 0 1 0 0 0 0 8.5 1 1 0 0 0 0 24.5 0 1 0 0 0 1 9.0 1 1 0 0 0 1 25.0 0 1 0 0 1 0 9.5 1 1 0 0 1 0 25.5 0 1 0 0 1 1 10.0 1 1 0 0 1 1 26.0 0 1 0 1 0 0 10.5 1 1 0 1 0 0 26.5 0 1 0 1 0 1 11.0 1 1 0 1 0 1 27.0 0 1 0 1 1 0 11.5 1 1 0 1 1 0 27.5 0 1 0 1 1 1 12.0 1 1 0 1 1 1 28.0 0 1 1 0 0 0 12.5 1 1 1 0 0 0 28.5 0 1 1 0 0 1 13.0 1 1 1 0 0 1 29.0 0 1 1 0 1 0 13.5 1 1 1 0 1 0 29.5 0 1 1 0 1 1 14.0 1 1 1 0 1 1 30.0 0 1 1 1 0 0 14.5 1 1 1 1 0 0 30.5 0 1 1 1 0 1 15.0 1 1 1 1 0 1 31.0 0 1 1 1 1 0 15.5 1 1 1 1 1 0 31.5 0 1 1 1 1 1 16.0 1 1 1 1 1 1 32.0 technical note 8/11 www.rohm.com 2011.04 - rev. a ? 2011 rohm co., ltd. all rights reserved. BD1606MVV (2) charge pump a) description of operations pin voltage comparison takes place at vout control se ction, and then vout generaton ta kes place so that the led cathode voltage with the highest vf is set to 0.1v. a boost rate is changed automatically to a proper one at the charge pump mode control section so that oper ation can take place at possible low b oost rate. when the current taken from vbat exceeds 600ma, the overcurrent limiter is activated and th is ic is reset. in addition, if the output voltage falls below 1.5v, this ic is reset for short-circuit at output. b) soft start function BD1606MVV have a soft start function that prevents the rush current. soft start ordinal mode en/led* vout i led t off fig.15 soft start c) automatic b oost rate change the boost rate automatically switches to the best mode. * (1 mode -> 1.5 mode) or (1.5 mode -> 2 mode) if a battery voltage drop occurs BD1606MVV cannot maintain the led constant current, and then mode transition begins. * (1.5 mode -> 1 mode) or (2 mode -> 1.5 mode) if a battery voltage rise occurs, vout and vin detection are activated, and then mode transition begins. (3) uvlo (ultra low voltage lock out) if the input voltage falls below 2.2v, BD1606MVV is shut do wn to prevent malfunction due to ultra-low voltage. (4) ovp (over voltage protection) this circuit protects this ic against damage when the c/p output voltage (vout) rises extremely for some external factors. (5) thermal shutdown (tsd) to protect this ic against thermal damage or heat-driven unc ontrolled operations, this circuit turns off the output if the chip temperature rises over 150 . in addition, it turns on the output if the te mperature returns to the normal temperature. because the built-in thermal protection ci rcuit is intended to protect the ic it self, the thermal shutdown detection temperature must be set to below 150 in thermal design. technical note 9/11 www.rohm.com 2011.04 - rev. a ? 2011 rohm co., ltd. all rights reserved. BD1606MVV recommended pcb layout in pcb design, wire the power supply line in a way that the pcb impedance goes low and provide a bypass capacitor if needed. en vout vbat scl to substrate gnd gnd sda to substrate vcc cout cin c1 c2 cin c1 c2 vcc cout vout sda scl rear-side gnd en fig.16 application layout image (top view) fig.17 front (top view) application parts selection method capacitor (use a ceramics capacitor with good frequency and temperature characteristics.) symbol recommended value recommended parts type cout,cin,c1,c2 1 f grm188b11a105ka61b(murata) ceramics capacitor connect an input bypass capacitor cin between vbat/vin and gnd pin and an output capacitor between vout and gnd pin in proximity. place both c1p-c1n and c2p-c2n capacitors in proximity to the chip furthermore, select a ceramics capacitor with a sufficient rating for voltage to be applied. when other than these parts are used, the equivalent parts must be used. technical note 10/11 www.rohm.com 2011.04 - rev. a ? 2011 rohm co., ltd. all rights reserved. BD1606MVV n otes for use (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characteri stics can be provided approx imately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can break down ics. take prot ective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and the gnd lines. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dro pout at a low temperature, t hus determining the constant. (5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potentia l lower than the gnd voltage including an actual electric transient. (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connect ed to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each pr ocess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then di smount it from the jig. in addition, for protection against static electricity, estab lish a ground for the assembly process and pay thorough attention to the transportation and t he storage of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are in evitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operati on, thus resulting in a malfunction and then breakdown of the input terminal. therefore, pay thorou gh attention not to handle the input te rminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply vo ltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electr ical characteristics. (10) ground wiring pattern if small-signal gnd and large-current g nd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal gnd. pay att ention not to cause fluctuations in the gnd wiring pattern of external parts as well. (11) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant wi th consideration given to a degradation in the nominal capacitance due to dc bias and c hanges in the capacitance due to temperature, etc. (12) thermal shutdown circuit (tsd) when junction temperatures become 175c (typ) or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aimed at isolating the lsi from thermal run away as much as possible, is not aimed at the protection or guarantee of the lsi. ther efore, do not continuously us e the lsi with this circuit operating or use the lsi assuming its operation (13) thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual states of use. (14) coil selection to reduce the loss, select a coil with a small wound resistor for dc/dc converter output. technical note 11/11 www.rohm.com 2011.04 - rev. a ? 2011 rohm co., ltd. all rights reserved. BD1606MVV ordering part number b d 1 6 0 6 m v v - e 2 part no. part no. 1606 package mvv: sqfn016v4040 packaging and forming specification e2: embossed tape and reel ? order quantity needs to be multiple of the minimum quantity. r1120 a www.rohm.com ? 2011 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law. |
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